> Exhibitors Inventions > 2019
| Title | Solid Solution Lead-free Solder Interconnects on Different Surface Finish for Next Generation Electric Vehicle Power Mod | |||||
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| Inventor | UNIMAP | Year | 2019 | |||
| Country | Malaysia | Regist No | Date | 2019-12-16 | ||
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Preview
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PulFMAP: A New Generation of Lightweight Structural |
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Emergency vehicle traffic warning device andwarning system |
