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Exhibitors Inventions

Seoul International Invention Fair
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Exhibitors inventions 게시글의 상세 화면
Title The heat conduction structure with an airtight empty interior tier
Department Environmental Protection Year 2014
Company Deguang Catholic High School Regist No Patent No: R.O.C. M 470623 Date 2014-12-15
The heat conduction structure with an airtight empty interior tier includes one fixed base and one cover body. The fixed base is settled in a container, and fit with the interior heat-absorbing surface of the container; the outside of heat-absorbing surface corresponds to the position of the heat. The cover body is integrated with the fixed base, and the cover body has an inner wall and outer wall. There is a distance between the inner wall and outer wall, and it can form an airtight empty interior tier in order to avoid the liquid in the heat conduction space transmitting heat directly from the cover body through outside; thus, the heat-absorbing surface can heat the liquid quickly in the heat conduction space. The cover body is movable to be settled on the fixed base. By using this invention, the objective of time and energy saving can be achieved .To boil water for example, about 30%~35% of energy can be saved if this design is used.
Exhibitors inventions 게시판의 이전글 다음글
이전글 Preview Steam locomotive exhaust filte
이전글 Next Deep-water bottom geophysical station for the passive electro-seismic prospecting of deposits of hydrocarbons including at the Arctic shelf.
SIIF 2020 Seoul International Ivention Fair 2020
Korea Intellectual Property Service Center 17F, 131 Teheran-ro, Gangnam-gu, Seoul, Republic of Korea 06133
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