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2016

Seoul International Invention Fair
SIIF 는 전문적인경험과 지식을 가지고 있으며
성공적인 발명전시회를 개최할 수 있도록 노력하겠습니다.
전시선정기술 게시글의 상세 화면
제목 The heat conduction structure with an airtight empty interior tier
분야 환경보호 년도 2014
업체명 Deguang Catholic High School 등록번호 Patent No: R.O.C. M 470623 등록일 2014-12-15
The heat conduction structure with an airtight empty interior tier includes one fixed base and one cover body. The fixed base is settled in a container, and fit with the interior heat-absorbing surface of the container; the outside of heat-absorbing surface corresponds to the position of the heat. The cover body is integrated with the fixed base, and the cover body has an inner wall and outer wall. There is a distance between the inner wall and outer wall, and it can form an airtight empty interior tier in order to avoid the liquid in the heat conduction space transmitting heat directly from the cover body through outside; thus, the heat-absorbing surface can heat the liquid quickly in the heat conduction space. The cover body is movable to be settled on the fixed base. By using this invention, the objective of time and energy saving can be achieved .To boil water for example, about 30%~35% of energy can be saved if this design is used.
전시선정기술 게시판의 이전글 다음글
이전글 이전글 Steam locomotive exhaust filte
이전글 다음글 Deep-water bottom geophysical station for the passive electro-seismic prospecting of deposits of hydrocarbons including at the Arctic shelf.
SIIF 2020 Seoul International Ivention Fair 2020
서울시 강남구 테헤란로 131(역삼동 647-9) 한국지식재산센터 17층 국제협력실
TEL : 02)3459-2843 / 2924    FAX : 02)3459-2879    EMAIL : siif@kipa.org